sam-test-conf

Contribution List

1. test contribution 1

Aal Fischmuetze, Dr Daniel Johnson (CERN)

23/07/2020, 05:00

Main Track

Description of test contribution 1

2. abstract-1

abdelghani berrabah

Main Track

Chiplet integration using 2.5D packaging is gaining popularity nowadays which enables several interesting features like heterogeneous integration and drop-in design method. In the traditional die-by-die approach of designing a 2.5D system, each chiplet is designed independently without any knowledge of the package RDLs. In this paper, we propose a Chip-Package Co-Design flow for implementing...

3. PowerNet: Transferable Dynamic IR Drop Estimation via Maximum Convolutional Neural Network

Chayan Majumdar (IIT Bombay), Dr sssx w

Main Track

IR drop is a fundamental constraint required by almost all chip designs. However, its evaluation usually takes a long time that hinders mitigation techniques for fixing its violations. In this work, we develop a fast dynamic IR drop estimation technique, named PowerNet, based on a convolutional neural network (CNN). It can handle both vector-based and vectorless IR analyses. Moreover, the...